3D IC Stacking Technology

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Telecommunications
Cover of the book 3D IC Stacking Technology by Banqiu Wu, Sesh Ramaswami, Ajay Kumar, McGraw-Hill Education
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar ISBN: 9780071741965
Publisher: McGraw-Hill Education Publication: October 14, 2011
Imprint: McGraw-Hill Education Language: English
Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar
ISBN: 9780071741965
Publisher: McGraw-Hill Education
Publication: October 14, 2011
Imprint: McGraw-Hill Education
Language: English

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

More books from McGraw-Hill Education

Cover of the book Tuesday Morning Coaching: Eight Simple Truths to Boost Your Career and Your Life by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Cardiology Clinical Questions, Second Edition by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Global Supply Chain Management: Leveraging Processes, Measurements, and Tools for Strategic Corporate Advantage by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Winning the Customer: Turn Consumers into Fans and Get Them to Spend More by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Mutual Funds for the Utterly Confused by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The VAR Implementation Handbook, Chapter 10 - Value-at-Risk-Based Stop-Loss Trading by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Principles of Computer Security, Fourth Edition by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The Color Atlas of Physical Therapy by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Programming Arduino: Getting Started with Sketches by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Silicon-on-Sapphire Circuits and Systems by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book 5 Steps to a 5: 500 AP Physics 2 Questions to Know by Test Day by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book MATLAB Numerical Methods with Chemical Engineering Applications by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Perfect Phrases for Job Seekers (EBOOK BUNDLE) by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Portfolio Performance Measurement and Benchmarking, Chapter 33 - GIPS by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book How to Make Money with Junk Bonds by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy