3D IC Stacking Technology

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Telecommunications
Cover of the book 3D IC Stacking Technology by Banqiu Wu, Sesh Ramaswami, Ajay Kumar, McGraw-Hill Education
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Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar ISBN: 9780071741965
Publisher: McGraw-Hill Education Publication: October 14, 2011
Imprint: McGraw-Hill Education Language: English
Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar
ISBN: 9780071741965
Publisher: McGraw-Hill Education
Publication: October 14, 2011
Imprint: McGraw-Hill Education
Language: English

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

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