by
Haleh Ardebili, Jiawei Zhang, Michael Pecht
Language: English
Release Date: October 23, 2018
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...