Constrained Deformation of Materials

Devices, Heterogeneous Structures and Thermo-Mechanical Modeling

Nonfiction, Science & Nature, Technology, Engineering, Industrial, Mechanical
Cover of the book Constrained Deformation of Materials by Y.-L. Shen, Springer US
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Y.-L. Shen ISBN: 9781441963123
Publisher: Springer US Publication: August 9, 2010
Imprint: Springer Language: English
Author: Y.-L. Shen
ISBN: 9781441963123
Publisher: Springer US
Publication: August 9, 2010
Imprint: Springer
Language: English

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

More books from Springer US

Cover of the book Steroid and Sterol Hormone Action by Y.-L. Shen
Cover of the book Molecular Aspects of Early Development by Y.-L. Shen
Cover of the book The Foreman/Supervisor’s Handbook by Y.-L. Shen
Cover of the book Ultrastructure of the Digestive Tract by Y.-L. Shen
Cover of the book Thyroid Ultrasound and Ultrasound-Guided FNA Biopsy by Y.-L. Shen
Cover of the book The Biology of Alcoholism by Y.-L. Shen
Cover of the book Lasers by Y.-L. Shen
Cover of the book Behavioral Decision Making by Y.-L. Shen
Cover of the book Leukocyte Recruitment, Endothelial Cell Adhesion Molecules, and Transcriptional Control by Y.-L. Shen
Cover of the book Recent Advances in Aquaculture by Y.-L. Shen
Cover of the book Genomic Diversity by Y.-L. Shen
Cover of the book Human Growth by Y.-L. Shen
Cover of the book Expertise in Mathematics Instruction by Y.-L. Shen
Cover of the book Language, Thought, and the Brain by Y.-L. Shen
Cover of the book Advances in Nuclear Physics by Y.-L. Shen
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy