Copper Electrodeposition for Nanofabrication of Electronics Devices
Nonfiction, Science & Nature, Technology, Nanotechnology, Science, Chemistry, Physical & Theoretical
| Author: | ISBN: | 9781461491767 | |
| Publisher: | Springer New York | Publication: | November 20, 2013 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9781461491767 |
| Publisher: | Springer New York |
| Publication: | November 20, 2013 |
| Imprint: | Springer |
| Language: | English |
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
