Design for Manufacturability

From 1D to 4D for 90–22 nm Technology Nodes

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Design for Manufacturability by Artur Balasinski, Springer New York
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Author: Artur Balasinski ISBN: 9781461417613
Publisher: Springer New York Publication: October 5, 2013
Imprint: Springer Language: English
Author: Artur Balasinski
ISBN: 9781461417613
Publisher: Springer New York
Publication: October 5, 2013
Imprint: Springer
Language: English

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

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