Electrical Design of Through Silicon Via
Nonfiction, Computers, Advanced Computing, Programming, Expert Systems, Science & Nature, Technology, Electronics, Circuits
| Author: | ISBN: | 9789401790383 | |
| Publisher: | Springer Netherlands | Publication: | May 11, 2014 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9789401790383 |
| Publisher: | Springer Netherlands |
| Publication: | May 11, 2014 |
| Imprint: | Springer |
| Language: | English |
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
