Electroless Copper and Nickel-Phosphorus Plating

Processing, Characterisation and Modelling

Nonfiction, Science & Nature, Technology, Electronics, Digital
Cover of the book Electroless Copper and Nickel-Phosphorus Plating by W Sha, K G Keong, Xiaomin Wu, Elsevier Science
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: W Sha, K G Keong, Xiaomin Wu ISBN: 9780857090966
Publisher: Elsevier Science Publication: January 1, 2011
Imprint: Woodhead Publishing Language: English
Author: W Sha, K G Keong, Xiaomin Wu
ISBN: 9780857090966
Publisher: Elsevier Science
Publication: January 1, 2011
Imprint: Woodhead Publishing
Language: English

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

  • Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications
  • Chapters review areas such as surface morphology and residual stress, modelling surface structure, crystallisation of nickel-phosphorus deposits and hardness evolution
  • An invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

More books from Elsevier Science

Cover of the book Innovations in Food Packaging by W Sha, K G Keong, Xiaomin Wu
Cover of the book Design to Thrive by W Sha, K G Keong, Xiaomin Wu
Cover of the book The Dictionary of Virology by W Sha, K G Keong, Xiaomin Wu
Cover of the book Polymers and Nanomaterials for Gene Therapy by W Sha, K G Keong, Xiaomin Wu
Cover of the book Speciality Wines by W Sha, K G Keong, Xiaomin Wu
Cover of the book Contemporary Aspects of Boron: Chemistry and Biological Applications by W Sha, K G Keong, Xiaomin Wu
Cover of the book Project Finance in Theory and Practice by W Sha, K G Keong, Xiaomin Wu
Cover of the book Advances in Organometallic Chemistry by W Sha, K G Keong, Xiaomin Wu
Cover of the book Food Processing Technology by W Sha, K G Keong, Xiaomin Wu
Cover of the book Hydrogen Peroxide and Cell Signaling, Part C by W Sha, K G Keong, Xiaomin Wu
Cover of the book Acoustic Emission and Related Non-destructive Evaluation Techniques in the Fracture Mechanics of Concrete by W Sha, K G Keong, Xiaomin Wu
Cover of the book Advances in Applied Microbiology by W Sha, K G Keong, Xiaomin Wu
Cover of the book Current Approaches to Occupational Health by W Sha, K G Keong, Xiaomin Wu
Cover of the book Intelligent Textiles and Clothing by W Sha, K G Keong, Xiaomin Wu
Cover of the book Construction Delays by W Sha, K G Keong, Xiaomin Wu
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy