Electromigration Modeling at Circuit Layout Level

Nonfiction, Science & Nature, Technology, Quality Control, Electronics, Circuits
Cover of the book Electromigration Modeling at Circuit Layout Level by Feifei He, Cher Ming Tan, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Feifei He, Cher Ming Tan ISBN: 9789814451215
Publisher: Springer Singapore Publication: March 16, 2013
Imprint: Springer Language: English
Author: Feifei He, Cher Ming Tan
ISBN: 9789814451215
Publisher: Springer Singapore
Publication: March 16, 2013
Imprint: Springer
Language: English

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

More books from Springer Singapore

Cover of the book Continuum Damage and Fracture Mechanics by Feifei He, Cher Ming Tan
Cover of the book Creativity, Design Thinking and Interdisciplinarity by Feifei He, Cher Ming Tan
Cover of the book Legal Certainty in a Contemporary Context by Feifei He, Cher Ming Tan
Cover of the book Management of Information, Process and Cooperation by Feifei He, Cher Ming Tan
Cover of the book Optimisation of ZnO Thin Films by Feifei He, Cher Ming Tan
Cover of the book Phosphors, Up Conversion Nano Particles, Quantum Dots and Their Applications by Feifei He, Cher Ming Tan
Cover of the book Governance and Risk Management in Taxation by Feifei He, Cher Ming Tan
Cover of the book Axial Turbine Aerodynamics for Aero-engines by Feifei He, Cher Ming Tan
Cover of the book Self-determinable Development of Small Islands by Feifei He, Cher Ming Tan
Cover of the book Cell Therapy for Perinatal Brain Injury by Feifei He, Cher Ming Tan
Cover of the book Dynamic Modeling of Complex Industrial Processes: Data-driven Methods and Application Research by Feifei He, Cher Ming Tan
Cover of the book Abiotic Stress Management for Resilient Agriculture by Feifei He, Cher Ming Tan
Cover of the book Place/No-Place in Urban Asian Religiosity by Feifei He, Cher Ming Tan
Cover of the book Distributed Transmission-Distribution Coordinated Energy Management Based on Generalized Master-Slave Splitting Theory by Feifei He, Cher Ming Tan
Cover of the book Drug Design: Principles and Applications by Feifei He, Cher Ming Tan
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy