Electromigration Modeling at Circuit Layout Level

Nonfiction, Science & Nature, Technology, Quality Control, Electronics, Circuits
Cover of the book Electromigration Modeling at Circuit Layout Level by Feifei He, Cher Ming Tan, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Feifei He, Cher Ming Tan ISBN: 9789814451215
Publisher: Springer Singapore Publication: March 16, 2013
Imprint: Springer Language: English
Author: Feifei He, Cher Ming Tan
ISBN: 9789814451215
Publisher: Springer Singapore
Publication: March 16, 2013
Imprint: Springer
Language: English

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

More books from Springer Singapore

Cover of the book Next Generation Spin Torque Memories by Feifei He, Cher Ming Tan
Cover of the book General Principles of Thai Private Law by Feifei He, Cher Ming Tan
Cover of the book Acoustic Textiles by Feifei He, Cher Ming Tan
Cover of the book Foundations of Molecular Modeling and Simulation by Feifei He, Cher Ming Tan
Cover of the book III-Nitride Based Light Emitting Diodes and Applications by Feifei He, Cher Ming Tan
Cover of the book Sustainability and Social Responsibility of Accountability Reporting Systems by Feifei He, Cher Ming Tan
Cover of the book Ravine Lands: Greening for Livelihood and Environmental Security by Feifei He, Cher Ming Tan
Cover of the book Physical Layer Security in Random Cellular Networks by Feifei He, Cher Ming Tan
Cover of the book Cancellous Bone by Feifei He, Cher Ming Tan
Cover of the book Seamless Learning in the Age of Mobile Connectivity by Feifei He, Cher Ming Tan
Cover of the book Proceedings of the International Colloquium in Textile Engineering, Fashion, Apparel and Design 2014 (ICTEFAD 2014) by Feifei He, Cher Ming Tan
Cover of the book The Sound inside the Silence by Feifei He, Cher Ming Tan
Cover of the book Contemporary Management and Science Issues in the Halal Industry by Feifei He, Cher Ming Tan
Cover of the book Sustainable Energy Technology and Policies by Feifei He, Cher Ming Tan
Cover of the book Re-emerging Russia by Feifei He, Cher Ming Tan
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy