Guidebook for Managing Silicon Chip Reliability

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Engineering, Mechanical
Cover of the book Guidebook for Managing Silicon Chip Reliability by Michael Pecht, Riko Radojcic, Gopal Rao, CRC Press
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Author: Michael Pecht, Riko Radojcic, Gopal Rao ISBN: 9781351443562
Publisher: CRC Press Publication: November 22, 2017
Imprint: CRC Press Language: English
Author: Michael Pecht, Riko Radojcic, Gopal Rao
ISBN: 9781351443562
Publisher: CRC Press
Publication: November 22, 2017
Imprint: CRC Press
Language: English

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

failure sites, operational loads, and failure mechanism

intrinsic device sensitivities

electromigration

hot carrier aging

time dependent dielectric breakdown

mechanical stress induced migration

alpha particle sensitivity

electrostatic discharge (ESD) and electrical overstress

latch-up

qualification

screening

guidelines for designing reliability

Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

failure sites, operational loads, and failure mechanism

intrinsic device sensitivities

electromigration

hot carrier aging

time dependent dielectric breakdown

mechanical stress induced migration

alpha particle sensitivity

electrostatic discharge (ESD) and electrical overstress

latch-up

qualification

screening

guidelines for designing reliability

Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

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