Low Dielectric Constant Materials for IC Applications

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Low Dielectric Constant Materials for IC Applications by , Springer Berlin Heidelberg
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783642559082
Publisher: Springer Berlin Heidelberg Publication: December 6, 2012
Imprint: Springer Language: English
Author:
ISBN: 9783642559082
Publisher: Springer Berlin Heidelberg
Publication: December 6, 2012
Imprint: Springer
Language: English

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

More books from Springer Berlin Heidelberg

Cover of the book Sensortechnik by
Cover of the book Didaktik der Analytischen Geometrie und Linearen Algebra by
Cover of the book Classification and Data Mining by
Cover of the book Anaesthesia — Innovations in Management by
Cover of the book Orbital Inflammatory Diseases and Their Differential Diagnosis by
Cover of the book Hormonal Control of Lactation by
Cover of the book Coding and Decoding of Calcium Signals in Plants by
Cover of the book Tribology in Total Hip and Knee Arthroplasty by
Cover of the book Toward A More Balanced Approach: Rethinking and Readjusting Copyright Systems in the Digital Network Era by
Cover of the book Foresighted Leading by
Cover of the book Lipoprotein Metabolism by
Cover of the book Basic and Clinical Research on Renal Cell Carcinoma by
Cover of the book Genomics of Plant-Associated Fungi: Monocot Pathogens by
Cover of the book The Neurons of the First Optic Ganglion of the Bee (Apis mellifera) by
Cover of the book Acute Ischemic Stroke by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy