Materials for Electronic Packaging

Nonfiction, Science & Nature, Technology, Industrial Design, Electronics
Cover of the book Materials for Electronic Packaging by Deborah D.L. Chung, Elsevier Science
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Author: Deborah D.L. Chung ISBN: 9780080511177
Publisher: Elsevier Science Publication: March 31, 1995
Imprint: Butterworth-Heinemann Language: English
Author: Deborah D.L. Chung
ISBN: 9780080511177
Publisher: Elsevier Science
Publication: March 31, 1995
Imprint: Butterworth-Heinemann
Language: English

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

  • Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
  • Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
  • Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

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