| Author: | Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss | ISBN: | 9789813229372 |
| Publisher: | World Scientific Publishing Company | Publication: | January 3, 2018 |
| Imprint: | WSPC | Language: | English |
| Author: | Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss |
| ISBN: | 9789813229372 |
| Publisher: | World Scientific Publishing Company |
| Publication: | January 3, 2018 |
| Imprint: | WSPC |
| Language: | English |
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.
This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Contents:
- Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)
- Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)
- Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)
- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)
- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Sandra Winkler and Ramesh Ramadoss)
- PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)
- Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas W Kenny)
- Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)
- Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)
- Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)
- Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)
- Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)
- MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht)
Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics.
Key Features:
- The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systems
- It is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.
This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Contents:
- Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)
- Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)
- Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)
- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)
- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Sandra Winkler and Ramesh Ramadoss)
- PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)
- Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas W Kenny)
- Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)
- Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)
- Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)
- Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)
- Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)
- MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht)
Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics.
Key Features:
- The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systems
- It is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics
