Nanometer CMOS ICs

From Basics to ASICs

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Nanometer CMOS ICs by Harry J.M. Veendrick, Springer International Publishing
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Author: Harry J.M. Veendrick ISBN: 9783319475974
Publisher: Springer International Publishing Publication: April 28, 2017
Imprint: Springer Language: English
Author: Harry J.M. Veendrick
ISBN: 9783319475974
Publisher: Springer International Publishing
Publication: April 28, 2017
Imprint: Springer
Language: English

This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits.  It includes aspects of scaling to even beyond 12nm CMOS technologies and designs.  It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application.  Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks.  The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.

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This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits.  It includes aspects of scaling to even beyond 12nm CMOS technologies and designs.  It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application.  Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks.  The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.

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