Nanopackaging: From Nanomaterials to the Atomic Scale

Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013

Nonfiction, Science & Nature, Science, Other Sciences, Nanostructures, Technology, Nanotechnology
Cover of the book Nanopackaging: From Nanomaterials to the Atomic Scale by , Springer International Publishing
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Author: ISBN: 9783319211947
Publisher: Springer International Publishing Publication: August 6, 2015
Imprint: Springer Language: English
Author:
ISBN: 9783319211947
Publisher: Springer International Publishing
Publication: August 6, 2015
Imprint: Springer
Language: English

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

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