Photonic Packaging Sourcebook

Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

Nonfiction, Science & Nature, Technology, Microwaves, Nanotechnology
Cover of the book Photonic Packaging Sourcebook by Ulrich H. P. Fischer-Hirchert, Springer Berlin Heidelberg
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Ulrich H. P. Fischer-Hirchert ISBN: 9783642253768
Publisher: Springer Berlin Heidelberg Publication: April 11, 2015
Imprint: Springer Language: English
Author: Ulrich H. P. Fischer-Hirchert
ISBN: 9783642253768
Publisher: Springer Berlin Heidelberg
Publication: April 11, 2015
Imprint: Springer
Language: English

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

More books from Springer Berlin Heidelberg

Cover of the book Many-Body Schrödinger Dynamics of Bose-Einstein Condensates by Ulrich H. P. Fischer-Hirchert
Cover of the book Business Networking by Ulrich H. P. Fischer-Hirchert
Cover of the book Monopsonistic Labour Markets and the Gender Pay Gap by Ulrich H. P. Fischer-Hirchert
Cover of the book Konzernrechnungslegung by Ulrich H. P. Fischer-Hirchert
Cover of the book Orthopaedic Surgery of the Limbs in Paraplegia by Ulrich H. P. Fischer-Hirchert
Cover of the book Current Research in Ophthalmic Electron Microscopy by Ulrich H. P. Fischer-Hirchert
Cover of the book Ovarian Pathology by Ulrich H. P. Fischer-Hirchert
Cover of the book Language, Discourse, and Praxis in Ancient China by Ulrich H. P. Fischer-Hirchert
Cover of the book The Chemical History of Color by Ulrich H. P. Fischer-Hirchert
Cover of the book Handbuch Industrie 4.0 Bd.2 by Ulrich H. P. Fischer-Hirchert
Cover of the book Enteroceptors by Ulrich H. P. Fischer-Hirchert
Cover of the book Datum und Kalender by Ulrich H. P. Fischer-Hirchert
Cover of the book Estimating Spoken Dialog System Quality with User Models by Ulrich H. P. Fischer-Hirchert
Cover of the book Hydrogen Bonded Supramolecular Structures by Ulrich H. P. Fischer-Hirchert
Cover of the book Variational, Topological, and Partial Order Methods with Their Applications by Ulrich H. P. Fischer-Hirchert
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy