Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Electricity, Computers, Networking & Communications
Cover of the book Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by Yue Ma, Christian Gontrand, CRC Press
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Yue Ma, Christian Gontrand ISBN: 9780429680069
Publisher: CRC Press Publication: March 8, 2019
Imprint: CRC Press Language: English
Author: Yue Ma, Christian Gontrand
ISBN: 9780429680069
Publisher: CRC Press
Publication: March 8, 2019
Imprint: CRC Press
Language: English

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

More books from CRC Press

Cover of the book Acceptance Sampling in Quality Control by Yue Ma, Christian Gontrand
Cover of the book Valuation by Yue Ma, Christian Gontrand
Cover of the book Glutathione In The Nervous System by Yue Ma, Christian Gontrand
Cover of the book Bayesian Psychometric Modeling by Yue Ma, Christian Gontrand
Cover of the book Solar Installations by Yue Ma, Christian Gontrand
Cover of the book Engineering Applications of Pneumatics and Hydraulics by Yue Ma, Christian Gontrand
Cover of the book Measurement, Instrumentation, and Sensors Handbook by Yue Ma, Christian Gontrand
Cover of the book Agile for Project Managers by Yue Ma, Christian Gontrand
Cover of the book Human Resource Management in Construction by Yue Ma, Christian Gontrand
Cover of the book Solar Energy Technology Handbook by Yue Ma, Christian Gontrand
Cover of the book Soil Phosphorus by Yue Ma, Christian Gontrand
Cover of the book Handbook of Electronic Package Design by Yue Ma, Christian Gontrand
Cover of the book Creative Engagement in Palliative Care by Yue Ma, Christian Gontrand
Cover of the book Circuits and Applications Using Silicon Heterostructure Devices by Yue Ma, Christian Gontrand
Cover of the book Digital Color Imaging Handbook by Yue Ma, Christian Gontrand
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy