Reliability and Failure of Electronic Materials and Devices

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Reliability and Failure of Electronic Materials and Devices by Milton Ohring, Lucian Kasprzak, Elsevier Science
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Author: Milton Ohring, Lucian Kasprzak ISBN: 9780080575520
Publisher: Elsevier Science Publication: November 3, 2014
Imprint: Academic Press Language: English
Author: Milton Ohring, Lucian Kasprzak
ISBN: 9780080575520
Publisher: Elsevier Science
Publication: November 3, 2014
Imprint: Academic Press
Language: English

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

  • Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
  • New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
  • New chapter on testing procedures, sample handling and sample selection, and experimental design
  • Coverage of new packaging materials, including plastics and composites
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

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