Reliability of Microtechnology

Interconnects, Devices and Systems

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Reliability of Microtechnology by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson, Springer New York
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Author: Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson ISBN: 9781441957603
Publisher: Springer New York Publication: February 7, 2011
Imprint: Springer Language: English
Author: Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson
ISBN: 9781441957603
Publisher: Springer New York
Publication: February 7, 2011
Imprint: Springer
Language: English

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

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