RF and Microwave Microelectronics Packaging

Nonfiction, Science & Nature, Technology, Microwaves, Electronics
Cover of the book RF and Microwave Microelectronics Packaging by , Springer US
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Author: ISBN: 9781441909848
Publisher: Springer US Publication: December 1, 2009
Imprint: Springer Language: English
Author:
ISBN: 9781441909848
Publisher: Springer US
Publication: December 1, 2009
Imprint: Springer
Language: English

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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