Semiconductor Process Reliability in Practice

Nonfiction, Science & Nature, Technology, Electronics, Solid State, Electricity
Cover of the book Semiconductor Process Reliability in Practice by Zhenghao Gan, Waisum Wong, Juin J. Liou, McGraw-Hill Education
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Author: Zhenghao Gan, Waisum Wong, Juin J. Liou ISBN: 9780071754286
Publisher: McGraw-Hill Education Publication: October 6, 2012
Imprint: McGraw-Hill Education Language: English
Author: Zhenghao Gan, Waisum Wong, Juin J. Liou
ISBN: 9780071754286
Publisher: McGraw-Hill Education
Publication: October 6, 2012
Imprint: McGraw-Hill Education
Language: English

Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

  • Basic device physics
  • Process flow for MOS manufacturing
  • Measurements useful for device reliability characterization
  • Hot carrier injection
  • Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB)
  • Negative bias temperature instability
  • Plasma-induced damage
  • Electrostatic discharge protection of integrated circuits
  • Electromigration
  • Stress migration
  • Intermetal dielectric breakdown
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

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