Silicon Optoelectronic Integrated Circuits
Nonfiction, Science & Nature, Technology, Lasers, Material Science
| Author: | Horst Zimmermann | ISBN: | 9783030058227 |
| Publisher: | Springer International Publishing | Publication: | January 30, 2019 |
| Imprint: | Springer | Language: | English |
| Author: | Horst Zimmermann |
| ISBN: | 9783030058227 |
| Publisher: | Springer International Publishing |
| Publication: | January 30, 2019 |
| Imprint: | Springer |
| Language: | English |
Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-µm CMOS. Numerous detailed illustrations help to elucidate the material.
Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-µm CMOS. Numerous detailed illustrations help to elucidate the material.
