Testing of Interposer-Based 2.5D Integrated Circuits
Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
| Author: | Ran Wang, Krishnendu Chakrabarty | ISBN: | 9783319547145 |
| Publisher: | Springer International Publishing | Publication: | March 20, 2017 |
| Imprint: | Springer | Language: | English |
| Author: | Ran Wang, Krishnendu Chakrabarty |
| ISBN: | 9783319547145 |
| Publisher: | Springer International Publishing |
| Publication: | March 20, 2017 |
| Imprint: | Springer |
| Language: | English |
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
