Thermal Design of Electronic Equipment

Nonfiction, Science & Nature, Technology, Electronics
Cover of the book Thermal Design of Electronic Equipment by Ralph Remsburg, CRC Press
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Ralph Remsburg ISBN: 9781351835916
Publisher: CRC Press Publication: December 19, 2017
Imprint: CRC Press Language: English
Author: Ralph Remsburg
ISBN: 9781351835916
Publisher: CRC Press
Publication: December 19, 2017
Imprint: CRC Press
Language: English

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.
Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.
Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

More books from CRC Press

Cover of the book Building Energy Simulation by Ralph Remsburg
Cover of the book Developments in Lymphoid Cell Biology by Ralph Remsburg
Cover of the book Handbook of Environmental Control by Ralph Remsburg
Cover of the book Measurement and Modeling of Silicon Heterostructure Devices by Ralph Remsburg
Cover of the book Fascial Anatomy of the Equine Forelimb by Ralph Remsburg
Cover of the book The Human Effect in Medicine by Ralph Remsburg
Cover of the book Vadose Zone Hydrology by Ralph Remsburg
Cover of the book Modern Statistics for the Social and Behavioral Sciences by Ralph Remsburg
Cover of the book Porous Silicon: From Formation to Applications: Optoelectronics, Microelectronics, and Energy Technology Applications, Volume Three by Ralph Remsburg
Cover of the book Surgical SBAs for Finals with Explanatory Answers by Ralph Remsburg
Cover of the book Intelligent Buildings and Building Automation by Ralph Remsburg
Cover of the book Building for a Changing Climate by Ralph Remsburg
Cover of the book Marine Bioenergy by Ralph Remsburg
Cover of the book Risk: An Introduction by Ralph Remsburg
Cover of the book Risk Management: 10 Principles by Ralph Remsburg
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy