Author: | Charles Bishop | ISBN: | 9780323296908 |
Publisher: | Elsevier Science | Publication: | August 15, 2015 |
Imprint: | William Andrew | Language: | English |
Author: | Charles Bishop |
ISBN: | 9780323296908 |
Publisher: | Elsevier Science |
Publication: | August 15, 2015 |
Imprint: | William Andrew |
Language: | English |
Vacuum Deposition onto Webs: Films and Foils, Third Edition, provides the latest information on vacuum deposition, the technology that applies an even coating to a flexible material that can be held on a roll, thereby offering a much faster and cheaper method of bulk coating than deposition onto single pieces or non-flexible surfaces such as glass.
This technology has been used in industrial-scale applications for some time, including a wide range of metalized packaging. Its potential as a high-speed, scalable process has seen an increasing range of new products emerging that employ this cost-effective technology, including solar energy products that are moving from rigid panels onto cheaper and more versatile flexible substrates, flexible electronic circuit ‘boards’, and flexible displays.
In this third edition, all chapters are thoroughly revised with a significant amount of new information added, including newly developed barrier measurement techniques, improved in-vacuum monitoring technologies, and the latest developments in Atomic Layer Deposition (ALD).
Vacuum Deposition onto Webs: Films and Foils, Third Edition, provides the latest information on vacuum deposition, the technology that applies an even coating to a flexible material that can be held on a roll, thereby offering a much faster and cheaper method of bulk coating than deposition onto single pieces or non-flexible surfaces such as glass.
This technology has been used in industrial-scale applications for some time, including a wide range of metalized packaging. Its potential as a high-speed, scalable process has seen an increasing range of new products emerging that employ this cost-effective technology, including solar energy products that are moving from rigid panels onto cheaper and more versatile flexible substrates, flexible electronic circuit ‘boards’, and flexible displays.
In this third edition, all chapters are thoroughly revised with a significant amount of new information added, including newly developed barrier measurement techniques, improved in-vacuum monitoring technologies, and the latest developments in Atomic Layer Deposition (ALD).