VLSI-SoC: Internet of Things Foundations

22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers

Nonfiction, Computers, Application Software, CAD/CAM, Computer Hardware, Input-Output Equipment, General Computing
Cover of the book VLSI-SoC: Internet of Things Foundations by , Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783319252797
Publisher: Springer International Publishing Publication: October 2, 2015
Imprint: Springer Language: English
Author:
ISBN: 9783319252797
Publisher: Springer International Publishing
Publication: October 2, 2015
Imprint: Springer
Language: English

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

More books from Springer International Publishing

Cover of the book Intergenerational Connections in Digital Families by
Cover of the book Non-Linear Viscoelasticity of Rubber Composites and Nanocomposites by
Cover of the book Regional Trajectories of Entrepreneurship, Knowledge, and Growth by
Cover of the book The Semantic Web – ISWC 2016 by
Cover of the book Machine Learning and Data Mining in Pattern Recognition by
Cover of the book Simply Local Flaps by
Cover of the book Psychosocial Approaches to Peace-Building in Colombia by
Cover of the book Context-Enhanced Information Fusion by
Cover of the book Photochemistry by
Cover of the book Tolkien and Alterity by
Cover of the book Peyronie’s Disease by
Cover of the book Energy Technology 2017 by
Cover of the book Women in Mathematics by
Cover of the book Neural Correlates of Quality Perception for Complex Speech Signals by
Cover of the book Human-Centered and Error-Resilient Systems Development by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy