Wafer Level 3-D ICs Process Technology
Nonfiction, Science & Nature, Technology, Material Science, Electronics
| Author: | ISBN: | 9780387765341 | |
| Publisher: | Springer US | Publication: | June 29, 2009 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9780387765341 |
| Publisher: | Springer US |
| Publication: | June 29, 2009 |
| Imprint: | Springer |
| Language: | English |
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
