3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Nonfiction, Science & Nature, Technology, Engineering
Cover of the book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng, Wiley
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Author: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ISBN: 9781119289661
Publisher: Wiley Publication: March 29, 2018
Imprint: Wiley-IEEE Press Language: English
Author: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng
ISBN: 9781119289661
Publisher: Wiley
Publication: March 29, 2018
Imprint: Wiley-IEEE Press
Language: English

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools
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An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

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