Lih Tyng Hwang: 1 book

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng
Language: English
Release Date: March 29, 2018

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and...

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