Advanced Analysis of Nontraditional Machining

Nonfiction, Science & Nature, Technology, Machinery, Material Science
Cover of the book Advanced Analysis of Nontraditional Machining by , Springer New York
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9781461440543
Publisher: Springer New York Publication: December 12, 2012
Imprint: Springer Language: English
Author:
ISBN: 9781461440543
Publisher: Springer New York
Publication: December 12, 2012
Imprint: Springer
Language: English

Nontraditional machining utilizes thermal, chemical, electrical, mechanical and optimal sources of energy to bind, form and cut materials. Advanced Analysis of Nontraditional Machining explains in-depth how each of these advanced machining processes work, their machining system components, and process variables and industrial applications, thereby offering advanced knowledge and scientific insight. This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Nontraditional machining utilizes thermal, chemical, electrical, mechanical and optimal sources of energy to bind, form and cut materials. Advanced Analysis of Nontraditional Machining explains in-depth how each of these advanced machining processes work, their machining system components, and process variables and industrial applications, thereby offering advanced knowledge and scientific insight. This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

More books from Springer New York

Cover of the book Introducing Spoken Dialogue Systems into Intelligent Environments by
Cover of the book Computational Intelligence in Biomedical Imaging by
Cover of the book An Absence of Competition by
Cover of the book Systems Biology of Tuberculosis by
Cover of the book Implementing Software Defined Radio by
Cover of the book Molecular Pathology of Nervous System Tumors by
Cover of the book Guidebook to the Constellations by
Cover of the book Reducing Benzodiazepine Consumption by
Cover of the book RFID as an Infrastructure by
Cover of the book Island Disputes and Maritime Regime Building in East Asia by
Cover of the book Giardia as a Foodborne Pathogen by
Cover of the book Voices of Diversity by
Cover of the book How to Photograph the Moon and Planets with Your Digital Camera by
Cover of the book Strategic Economic Decision-Making by
Cover of the book Cognitive Networked Sensing and Big Data by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy