Arbitrary Modeling of TSVs for 3D Integrated Circuits

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah, Yehea Ismail, Alaa El-Rouby, Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Khaled Salah, Yehea Ismail, Alaa El-Rouby ISBN: 9783319076119
Publisher: Springer International Publishing Publication: August 21, 2014
Imprint: Springer Language: English
Author: Khaled Salah, Yehea Ismail, Alaa El-Rouby
ISBN: 9783319076119
Publisher: Springer International Publishing
Publication: August 21, 2014
Imprint: Springer
Language: English

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

More books from Springer International Publishing

Cover of the book Fault Tolerant Control Schemes Using Integral Sliding Modes by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Case-Based Inpatient Pediatric Dermatology by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Recent Results on Nonlinear Delay Control Systems by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Microwave-assisted Polymer Synthesis by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Mechatronics for Cultural Heritage and Civil Engineering by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Mitochondrial Mechanisms of Degeneration and Repair in Parkinson's Disease by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Atlas of Pediatric Brain Tumors by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Foucault and Post-Financial Crises by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Emerging Challenges for Experimental Mechanics in Energy and Environmental Applications, Proceedings of the 5th International Symposium on Experimental Mechanics and 9th Symposium on Optics in Industry (ISEM-SOI), 2015 by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Neuro-Organizational Culture by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Energy Relations in the Euro-Mediterranean by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Service Orientation in Holonic and Multi-Agent Manufacturing by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Information Management and Big Data by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Data Management Technologies and Applications by Khaled Salah, Yehea Ismail, Alaa El-Rouby
Cover of the book Languages and Compilers for Parallel Computing by Khaled Salah, Yehea Ismail, Alaa El-Rouby
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy