Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
Nonfiction, Science & Nature, Technology, Material Science, Electronics
| Author: | Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma | ISBN: | 9781461492665 |
| Publisher: | Springer US | Publication: | November 5, 2014 |
| Imprint: | Springer | Language: | English |
| Author: | Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma |
| ISBN: | 9781461492665 |
| Publisher: | Springer US |
| Publication: | November 5, 2014 |
| Imprint: | Springer |
| Language: | English |
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
