| Author: | ISBN: | 9783527692965 | |
| Publisher: | Wiley | Publication: | September 4, 2017 |
| Imprint: | Wiley-VCH | Language: | English |
| Author: | |
| ISBN: | 9783527692965 |
| Publisher: | Wiley |
| Publication: | September 4, 2017 |
| Imprint: | Wiley-VCH |
| Language: | English |
Combining the materials science, technological, and device aspects of organic bioelectronics based on green materials, this is the first overview of the emerging concepts involving fabrication techniques for sustainable electronics with low energy and material consumption.
With contributions from top-notch editors and authors, in one focus, the book covers a collection of natural materials suited for electronics applications such as paper, silk, melanin, DNA and nucleobases, resins, gums, saccharides, cellulose, gelatine and peptides. In another thrust, the book focuses on device fabrication based on these materials, including processing aspects, and applications such as sensors, signal transducers, transient, implantable and digestible electronics.
With its interdisciplinary approach this text will appeal to the chemistry, physics, materials science, and engineering communities.
Combining the materials science, technological, and device aspects of organic bioelectronics based on green materials, this is the first overview of the emerging concepts involving fabrication techniques for sustainable electronics with low energy and material consumption.
With contributions from top-notch editors and authors, in one focus, the book covers a collection of natural materials suited for electronics applications such as paper, silk, melanin, DNA and nucleobases, resins, gums, saccharides, cellulose, gelatine and peptides. In another thrust, the book focuses on device fabrication based on these materials, including processing aspects, and applications such as sensors, signal transducers, transient, implantable and digestible electronics.
With its interdisciplinary approach this text will appeal to the chemistry, physics, materials science, and engineering communities.
