Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Nonfiction, Science & Nature, Technology, Material Science, Manufacturing
Cover of the book Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by Jie Cheng, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Jie Cheng ISBN: 9789811061653
Publisher: Springer Singapore Publication: September 6, 2017
Imprint: Springer Language: English
Author: Jie Cheng
ISBN: 9789811061653
Publisher: Springer Singapore
Publication: September 6, 2017
Imprint: Springer
Language: English

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

More books from Springer Singapore

Cover of the book Futuristic Composites by Jie Cheng
Cover of the book Evolutionary Economic Geography in China by Jie Cheng
Cover of the book Optically Active Polymers by Jie Cheng
Cover of the book Corporate Governance and Value Creation in Japan by Jie Cheng
Cover of the book Darwinian Evolution of Molecules by Jie Cheng
Cover of the book Analysis of Survival Data with Dependent Censoring by Jie Cheng
Cover of the book Singular Solutions in Plasticity by Jie Cheng
Cover of the book Bio-inspired Computing – Theories and Applications by Jie Cheng
Cover of the book Auction Based Resource Provisioning in Cloud Computing by Jie Cheng
Cover of the book Phasor Power Electronics by Jie Cheng
Cover of the book The Tree Shrew (Tupaia belangeri chinensis) Brain in Stereotaxic Coordinates by Jie Cheng
Cover of the book Non-metrisable Manifolds by Jie Cheng
Cover of the book Embedded System Technology by Jie Cheng
Cover of the book Arbitration in China by Jie Cheng
Cover of the book Regional Conference on Science, Technology and Social Sciences (RCSTSS 2014) by Jie Cheng
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy