Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Nonfiction, Science & Nature, Technology, Engineering, Mechanical, Electronics
Cover of the book Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture by E-H Wong, Y.-W. Mai, Elsevier Science
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Author: E-H Wong, Y.-W. Mai ISBN: 9780857099112
Publisher: Elsevier Science Publication: May 23, 2015
Imprint: Woodhead Publishing Language: English
Author: E-H Wong, Y.-W. Mai
ISBN: 9780857099112
Publisher: Elsevier Science
Publication: May 23, 2015
Imprint: Woodhead Publishing
Language: English

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

  • Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
  • Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
  • Includes program files and macros for additional study
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

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