Author: | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu | ISBN: | 9781461492634 |
Publisher: | Springer New York | Publication: | July 14, 2014 |
Imprint: | Springer | Language: | English |
Author: | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
ISBN: | 9781461492634 |
Publisher: | Springer New York |
Publication: | July 14, 2014 |
Imprint: | Springer |
Language: | English |
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.